Intel foundry lands a Pentagon packaging pilot while trailing on leading-edge wafers
Washington wants a trusted back-end. Leading-edge customers still want TSMC. Intel is trying to sell both stories from the same clean room.
James WhitakerTechnology Editor
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HILLSBORO, Ore. — Washington wants a trusted back-end. Leading-edge customers still want TSMC. Intel is trying to sell both stories from the same clean room.
The packaging award is real and modest. It does not settle the question of whether Intel 18A wins a second high-volume commercial tape-out this cycle.
James Whitaker
Technology Editor
Reports on semiconductors, cloud infrastructure, and the industrial politics of AI.