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TSMC lifts CoWoS allocation for U.S. cloud buyers after Arizona yield review

A better-than-feared yield print in Phoenix is freeing advanced packaging slots that hyperscalers have been waiting on since last winter.

James WhitakerTechnology Editor
Close-up of a semiconductor circuit board

Close-up of a semiconductor circuit board

PHOENIX — A better-than-feared yield print in Phoenix is freeing advanced packaging slots that hyperscalers have been waiting on since last winter.

Two cloud procurement officers said the extra CoWoS capacity is already spoken for through mid-2027, with training clusters first in line and inference overflow still hunting a second source.

James Whitaker

Technology Editor

Reports on semiconductors, cloud infrastructure, and the industrial politics of AI.